Application of fracture mechanics in electronic packaging :
presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas /
sponsored by the Applied Mechanics Division, ASME, the Electrical and Electronics Packaging Division, ASME ; edited by William T. Chen, David T. Read.

Description

Related Names

Read, D. T.
Chen, William T.
American Society of Mechanical Engineers. Electrical and Electronic Packaging Division.
American Society of Mechanical Engineers. Applied Mechanics Division.
International Mechanical Engineering Congress and Exposition Dallas, Tex.) (1997 :

Language(s)

English

Published

New York, N.Y. : American Society of Mechanical Engineers, c1997.

Subjects

Fracture mechanics > Fracture mechanics / Congresses.
Electronic packaging > Electronic packaging / Congresses.

Physical Description

vi, 193 p. : ill. ; 28 cm.

ISBN

0791818276

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