CAE/CAD and thermal management issues in electronic systems :
presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas /
sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by Dereje Agonafer ... [et al.].

Description

Related Names

Agonafer, D.
American Society of Mechanical Engineers. Electrical and Electronic Packaging Division.
International Mechanical Engineering Congress and Exposition Dallas, Tex.) (1997 :

Language(s)

English

Published

New York, N.Y. : American Society of Mechanical Engineers, c1997.

Subjects

Computer-aided design > Computer-aided design / Congresses.
Computer-aided engineering > Computer-aided engineering / Congresses.
Electronic systems > Electronic systems / Thermal properties > Electronic systems / Thermal properties / Congresses.
Electronic apparatus and appliances > Electronic apparatus and appliances / Temperature control > Electronic apparatus and appliances / Temperature control / Congresses.

Physical Description

v, 109 p. : ill. ; 28 cm.

ISBN

0791818527

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