Application of fracture mechanics in electronic packaging :
presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas /
sponsored by the Applied Mechanics Division, ASME, the Electrical and Electronics Packaging Division, ASME ; edited by William T. Chen, David T. Read.

APA Citation

Read, D. T., Chen, W. T., American Society of Mechanical Engineers. Electrical and Electronic Packaging Division., American Society of Mechanical Engineers. Applied Mechanics Division., International Mechanical Engineering Congress and Exposition (1997 : Dallas, T. (1997). Application of fracture mechanics in electronic packaging: presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas. New York, N.Y.: American Society of Mechanical Engineers.

MLA Citation

International Mechanical Engineering Congress and Exposition (1997 : Dallas, T, et al.. Application of Fracture Mechanics In Electronic Packaging: Presented At the 1997 ASME International Mechanical Engineering Congress And Exposition, November 16-21, 1997, Dallas, Texas. New York, N.Y.: American Society of Mechanical Engineers, 1997.