Manufacturing processes and materials challenges in microelectronic packaging :
presented at the Winter Annual Meeting of the American Society of Mechanical Engineers, Atlanta, Georgia, December 1-6, 1991 /
sponsored by the Applied Mechanics Division, ASME, the Electrical and Electronic Packaging Division, ASME ; edited by W.T. Chen, P. Engel, W.E. Jahsman.

Description

Related Names

Jahsman, W. E. (William E.)
Engel, Peter A.
Chen, William T.
American Society of Mechanical Engineers. Electrical and Electronic Packaging Division.
American Society of Mechanical Engineers. Applied Mechanics Division.
American Society of Mechanical Engineers. Winter Meeting

Language(s)

English

Published

New York, N.Y. : The Society, c1991.

Subjects

Microelectronic packaging > Microelectronic packaging / Congresses.
Electronic packaging > Electronic packaging / Congresses.

Physical Description

v, 153 p. : ill. ; 28 cm.

ISBN

0791808963

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