Applications of experimental mechanics to electronic packaging--1997-- :
presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas /
sponsored by the Electrical and Electronic Packaging Division, ASME, the Applied Mechanics Division, ASME ; edited by J.C. Suhling, K.M. Liechti, S. Liu
Description
- Language(s)
-
English
- Published
-
New York : American Society of Mechanical Engineers, c1997
- Physical Description
-
vi, 136 p. :
ill. ;
28 cm
- ISBN
-
0791818500
Viewability