Electronic and photonics packaging :
multi-scale electrical and mechanical systems : 2006 : presented at 2006 ASME International Mechanical Engineering Congress and Exposition, November 5-10, 2006, Chicago, Illinois, USA /
sponsored by the Electronic and Photonic Packaging Division, ASME.

Description

Meeting Name

International Mechanical Engineering Congress and Exposition Chicago, Ill.) (2006 :

Related Names

American Society of Mechanical Engineers. Electronic and Photonic Packaging Division.

Language(s)

English

Published

New York : American Society of Mechanical Engineers, c2007.

Subjects

Nanotechnology > Nanotechnology / Congresses.
Electronics > Electronics / Materials > Electronics / Materials / Environmental aspects > Electronics / Materials / Environmental aspects / Congresses.
Photonic crystals > Photonic crystals / Congresses.
Microelectromechanical systems > Microelectromechanical systems / Congresses.
Microelectronic packaging > Microelectronic packaging / Congresses.
Electronic packaging > Electronic packaging / Congresses.

Note

"Quality and reliability of electronic/photonics packaging, MEMS/NEMS packaging, MEMS/NEMS novel materials and structures, Ecoelectronics."

Physical Description

xix, 526 p. : ill. ; 28 cm.

ISBN

9780791847695
0791847691

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