Electronic and photonics packaging :
multi-scale electrical and mechanical systems : 2006 : presented at 2006 ASME International Mechanical Engineering Congress and Exposition, November 5-10, 2006, Chicago, Illinois, USA /
sponsored by the Electronic and Photonic Packaging Division, ASME.

APA Citation

International Mechanical Engineering Congress and Exposition (2006 : Chicago, I., American Society of Mechanical Engineers. Electronic and Photonic Packaging Division. (2007). Electronic and photonics packaging: multi-scale electrical and mechanical systems : 2006 : presented at 2006 ASME International Mechanical Engineering Congress and Exposition, November 5-10, 2006, Chicago, Illinois, USA. New York: American Society of Mechanical Engineers.

MLA Citation

International Mechanical Engineering Congress and Exposition (2006 : Chicago, Ill.), and American Society of Mechanical Engineers. Electronic and Photonic Packaging Division. Electronic And Photonics Packaging: Multi-scale Electrical And Mechanical Systems : 2006 : Presented At 2006 ASME International Mechanical Engineering Congress And Exposition, November 5-10, 2006, Chicago, Illinois, USA. New York: American Society of Mechanical Engineers, 2007.