Electronic and photonics packaging : multi-scale electrical and mechanical systems : 2006 : presented at 2006 ASME International Mechanical Engineering Congress and Exposition, November 5-10, 2006, Chicago, Illinois, USA

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111 2 ⊔ ‡aInternational Mechanical Engineering Congress and Exposition ‡d(2006 : ‡cChicago, Ill.)
245 1 0 ‡aElectronic and photonics packaging : ‡bmulti-scale electrical and mechanical systems : 2006 : presented at 2006 ASME International Mechanical Engineering Congress and Exposition, November 5-10, 2006, Chicago, Illinois, USA / ‡csponsored by the Electronic and Photonic Packaging Division, ASME.
246 3 ⊔ ‡aElectronic and photonic packaging 2006
246 3 ⊔ ‡aIMECE2006
246 3 ⊔ ‡aMulti-scale electrical and mechanical systems 2006
246 3 ⊔ ‡aElectronic and photonics packaging 2006
246 1 ⊔ ‡iOn spine: ‡aProceedings of IMECE2006
260 ⊔ ⊔ ‡aNew York : ‡bAmerican Society of Mechanical Engineers, ‡cc2007.
300 ⊔ ⊔ ‡axix, 526 p. : ‡bill. ; ‡c28 cm.
490 0 ⊔ ‡aEPP ; ‡vv. 6
500 ⊔ ⊔ ‡a"Quality and reliability of electronic/photonics packaging, MEMS/NEMS packaging, MEMS/NEMS novel materials and structures, Ecoelectronics."
504 ⊔ ⊔ ‡aIncludes bibliographical references and author index.
505 0 ⊔ ‡a2006 ASME MEMS/NEMS Packaging Symposium -- Symposium on Ecoelectronics -- Symposium on Novel Nano/Micro Materials and Structures for Electronic/Photonic Packaging -- Symposium on Quality and Reliability of Electronic/Photonic Packaging -- Multi-scale electrical and mechanical systems.
538 ⊔ ⊔ ‡aMode of access: Internet.
650 ⊔ 0 ‡aNanotechnology ‡vCongresses.
650 ⊔ 0 ‡aElectronics ‡xMaterials ‡xEnvironmental aspects ‡vCongresses.
650 ⊔ 0 ‡aPhotonic crystals ‡vCongresses.
650 ⊔ 0 ‡aMicroelectromechanical systems ‡vCongresses.
650 ⊔ 0 ‡aMicroelectronic packaging ‡vCongresses.
650 ⊔ 0 ‡aElectronic packaging ‡vCongresses.
710 2 ⊔ ‡aAmerican Society of Mechanical Engineers. ‡bElectronic and Photonic Packaging Division.
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