Electronic and photonic packaging, Integration and packaging of micro/nano/electronic systems--2005 :
presented at 2005 ASME International Mechanical Engineering Congress and Exposition : November 5-11, 2005, Orlando, Florida, USA /
sponsored by the Electronic and Photonic Packaging Division, ASME.

Description

Related Names

American Society of Mechanical Engineers. Electronic and Photonic Packaging Division.
International Mechanical Engineering Congress and Exposition Orlando, Fla.) (2005 :

Language(s)

English

Published

New York, N.Y. : ASME, c2005.

Subjects

Integrated circuits > Integrated circuits / Wafer-scale integration > Integrated circuits / Wafer-scale integration / Congresses.
Microelectromechanical systems > Microelectromechanical systems / Congresses.
Surface mount technology > Surface mount technology / Congresses.
Microelectronic packaging > Microelectronic packaging / Congresses.
Nanotechnology > Nanotechnology / Congresses.
Photonics > Photonics / Congresses.
Electronic packaging > Electronic packaging / Congresses.

Physical Description

xviii, 606 p. : ill. ; 28 cm.

ISBN

0791842177

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