Applications of experimental mechanics to electronic packaging--1997-- : presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas

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111 2 ⊔ ‡aInternational Mechanical Engineering Congress and Exposition ‡d(1997 : ‡cDallas, Tex.)
245 1 0 ‡aApplications of experimental mechanics to electronic packaging--1997-- : ‡bpresented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas / ‡csponsored by the Electrical and Electronic Packaging Division, ASME, the Applied Mechanics Division, ASME ; edited by J.C. Suhling, K.M. Liechti, S. Liu
260 ⊔ ⊔ ‡aNew York : ‡bAmerican Society of Mechanical Engineers, ‡cc1997
300 ⊔ ⊔ ‡avi, 136 p. : ‡bill. ; ‡c28 cm
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650 ⊔ 0 ‡aMechanics, Applied ‡vCongresses
650 ⊔ 0 ‡aElectronic packaging ‡vCongresses
700 1 ⊔ ‡aLiu, S. ‡q(Sheng), ‡d1963-
700 1 ⊔ ‡aLiechti, K. M
700 1 ⊔ ‡aSuhling, J. C. ‡q(Jeffrey C.)
710 2 ⊔ ‡aAmerican Society of Mechanical Engineers. ‡bApplied Mechanics Division
710 2 ⊔ ‡aAmerican Society of Mechanical Engineers. ‡bElectrical and Electronic Packaging Division
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