CAE/CAD and thermal management issues in electronic systems : presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas

LDR 01518nam a2200325 a 4500
001 003240106
003 MiAaHDL
005 20210817000000.0
006 m d
007 cr bn ---auaua
008 980202s1997 nyua b 101 0 eng c
020 ⊔ ⊔ ‡a0791818527
035 ⊔ ⊔ ‡a(MiU)990032401060106381
035 ⊔ ⊔ ‡asdr-miu.990032401060106381
035 ⊔ ⊔ ‡a(OCoLC)38156158
035 ⊔ ⊔ ‡z(MiU)Aleph003240106
040 ⊔ ⊔ ‡aUMC ‡cUMC ‡dEYM
042 ⊔ ⊔ ‡apcc
050 ⊔ 4 ‡aTK7870.25 ‡b.C34 1997
245 0 0 ‡aCAE/CAD and thermal management issues in electronic systems : ‡bpresented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas / ‡csponsored by the Electrical and Electronic Packaging Division, ASME ; edited by Dereje Agonafer ... [et al.].
260 ⊔ ⊔ ‡aNew York, N.Y. : ‡bAmerican Society of Mechanical Engineers, ‡cc1997.
300 ⊔ ⊔ ‡av, 109 p. : ‡bill. ; ‡c28 cm.
490 0 ⊔ ‡aHTD ; ‡vvol. 356
490 0 ⊔ ‡aEEP ; ‡vvol. 23
504 ⊔ ⊔ ‡aIncludes bibliographical references and index.
538 ⊔ ⊔ ‡aMode of access: Internet.
650 ⊔ 0 ‡aComputer-aided design ‡vCongresses.
650 ⊔ 0 ‡aComputer-aided engineering ‡vCongresses.
650 ⊔ 0 ‡aElectronic systems ‡xThermal properties ‡xCongresses.
650 ⊔ 0 ‡aElectronic apparatus and appliances ‡xTemperature control ‡xCongresses.
700 1 ⊔ ‡aAgonafer, D.
710 2 ⊔ ‡aAmerican Society of Mechanical Engineers. ‡bElectrical and Electronic Packaging Division.
711 2 ⊔ ‡aInternational Mechanical Engineering Congress and Exposition ‡d(1997 : ‡cDallas, Tex.)
CID ⊔ ⊔ ‡a003240106
DAT 0 ⊔ ‡a19980202000000.0 ‡b20210817000000.0
DAT 1 ⊔ ‡a20210924183831.0 ‡b2023-06-17T17:58:54Z
CAT ⊔ ⊔ ‡aSDR-MIU ‡dALMA ‡lprepare.pl-004-008
FMT ⊔ ⊔ ‡aBK
HOL ⊔ ⊔ ‡0sdr-miu.990032401060106381 ‡aMiU ‡bSDR ‡cMIU ‡pmdp.39015041737092 ‡sMIU ‡1990032401060106381
974 ⊔ ⊔ ‡bMIU ‡cMIU ‡d20230617 ‡sgoogle ‡umdp.39015041737092 ‡y1997 ‡ric ‡qbib ‡tUS bib date1 >= 1929