Cooling and thermal design of electronic systems :
presented at the 1995 ASME International Mechanical Engineering Congress and Exposition, November 12-17, 1995, San Francisco, California /
sponsored by the Heat Transfer Division, ASME, the Electrical and Electronic Packaging Division, ASME ; edited by Cristina H. Amon ... [et al.].

Description

Meeting Name

International Mechanical Engineering Congress and Exposition San Francisco, Calif.) (1995 :

Related Names

Amon, Cristina H.
American Society of Mechanical Engineers. Electrical and Electronic Packaging Division.
American Society of Mechanical Engineers. Heat Transfer Division.

Language(s)

English

Published

New York, N.Y. : American Society of Mechanical Engineers, c1995.

Subjects

Electronic apparatus and appliances > Electronic apparatus and appliances / Thermal properties > Electronic apparatus and appliances / Thermal properties / Congresses.
Electronic apparatus and appliances > Electronic apparatus and appliances / Cooling > Electronic apparatus and appliances / Cooling / Congresses.
Electronic systems > Electronic systems / Thermal properties > Electronic systems / Thermal properties / Congresses.
Electronic systems > Electronic systems / Cooling > Electronic systems / Cooling / Congresses.

Physical Description

vi, 233 p. : ill. ; 28 cm.

ISBN

0791817539

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