Cooling and thermal design of electronic systems :
presented at the 1995 ASME International Mechanical Engineering Congress and Exposition, November 12-17, 1995, San Francisco, California /
sponsored by the Heat Transfer Division, ASME, the Electrical and Electronic Packaging Division, ASME ; edited by Cristina H. Amon ... [et al.].

APA Citation

International Mechanical Engineering Congress and Exposition (1995 : San Francisco, C., Amon, C. H., American Society of Mechanical Engineers. Electrical and Electronic Packaging Division., American Society of Mechanical Engineers. Heat Transfer Division. (1995). Cooling and thermal design of electronic systems: presented at the 1995 ASME International Mechanical Engineering Congress and Exposition, November 12-17, 1995, San Francisco, California. New York, N.Y.: American Society of Mechanical Engineers.

MLA Citation

International Mechanical Engineering Congress and Exposition (1995 : San Francisco, Calif.), Cristina H Amon, American Society of Mechanical Engineers. Electrical and Electronic Packaging Division, and American Society of Mechanical Engineers. Heat Transfer Division. Cooling And Thermal Design of Electronic Systems: Presented At the 1995 ASME International Mechanical Engineering Congress And Exposition, November 12-17, 1995, San Francisco, California. New York, N.Y.: American Society of Mechanical Engineers, 1995.