Sensors in electronic packaging :
presented at the 1995 ASME International Mechanical Engineering Congress and Exposition, November 12-17, 1995, San Francisco, California /
sponsored by the Manufacturing Engineering Division, ASME, the Electrical and Electronic Packaging Division, ASME ; edited by Charles Ume, Chao Pin-Yeh.
Description
- Language(s)
-
English
- Published
-
New York, N.Y. : American Society of Mechanical Engineers, c1995.
- Physical Description
-
v, 123 p. :
ill. ;
28 cm.
- ISBN
-
0791817407
Viewability