Manufacturing processes and materials challenges in microelectronic packaging :
presented at the Winter Annual Meeting of the American Society of Mechanical Engineers, Atlanta, Georgia, December 1-6, 1991 /
sponsored by the Applied Mechanics Division, ASME, the Electrical and Electronic Packaging Division, ASME ; edited by W.T. Chen, P. Engel, W.E. Jahsman.

APA Citation

Jahsman, W. E. (William E.)., Engel, P. A., Chen, W. T., American Society of Mechanical Engineers. Electrical and Electronic Packaging Division., American Society of Mechanical Engineers. Applied Mechanics Division., American Society of Mechanical Engineers. Winter Meeting (1991 : Atlanta, G. (1991). Manufacturing processes and materials challenges in microelectronic packaging: presented at the Winter Annual Meeting of the American Society of Mechanical Engineers, Atlanta, Georgia, December 1-6, 1991. New York, N.Y.: The Society.

MLA Citation

American Society of Mechanical Engineers. Winter Meeting (1991 : Atlanta, G, et al.. Manufacturing Processes And Materials Challenges In Microelectronic Packaging: Presented At the Winter Annual Meeting of the American Society of Mechanical Engineers, Atlanta, Georgia, December 1-6, 1991. New York, N.Y.: The Society, 1991.