Manufacturing processes and materials challenges in microelectronic packaging : presented at the Winter Annual Meeting of the American Society of Mechanical Engineers, Atlanta, Georgia, December 1-6, 1991

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245 0 0 ‡aManufacturing processes and materials challenges in microelectronic packaging : ‡bpresented at the Winter Annual Meeting of the American Society of Mechanical Engineers, Atlanta, Georgia, December 1-6, 1991 / ‡csponsored by the Applied Mechanics Division, ASME, the Electrical and Electronic Packaging Division, ASME ; edited by W.T. Chen, P. Engel, W.E. Jahsman.
260 ‡aNew York, N.Y. : ‡bThe Society, ‡cc1991.
300 ‡av, 153 p. : ‡bill. ; ‡c28 cm.
490 0 ‡aEEP ; ‡vvol. 1
490 0 ‡aAMD ; ‡vvol. 131
504 ‡aIncludes bibliographical references and index.
538 ‡aMode of access: Internet.
650 0 ‡aMicroelectronic packaging ‡vCongresses.
650 0 ‡aElectronic packaging ‡vCongresses.
700 1 ‡aJahsman, W. E. ‡q(William E.)
700 1 ‡aEngel, Peter A.
700 1 ‡aChen, William T.
710 2 ‡aAmerican Society of Mechanical Engineers. ‡bElectrical and Electronic Packaging Division.
710 2 ‡aAmerican Society of Mechanical Engineers. ‡bApplied Mechanics Division.
710 2 ‡aAmerican Society of Mechanical Engineers. ‡bWinter Meeting ‡d(1991 : ‡cAtlanta, Ga.)
CID ‡a002799455
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