Eastern Electronics Packaging Conference :
[proceedings].

Description

Meeting Name

Eastern Electronics Packaging Conference.

Related Names

Institute of Electrical and Electronics Engineers. Boston Section.
Institute of Electrical and Electronics Engineers. Component Hybrid and Packaging Technologies Group.

Language(s)

English

Published

New York : Institute of Electrical and Electronics Engineers.

Subjects

Microelectronics > Microelectronics / Congresses.
Electronic apparatus and appliances > Electronic apparatus and appliances / Unit construction > Electronic apparatus and appliances / Unit construction / Congresses.
Electronic apparatus and appliances > Electronic apparatus and appliances / Design and Construction > Electronic apparatus and appliances / Design and Construction / Congresses.

Note

Sponsored 1970- by the Component Hybrid and Packaging Technologies Group (called the Parts, Material and Packaging Group) and the Boston Section of the IEEE.
Some vols. have also distinctive titles.

Physical Description

v. : ill. ; 28 cm.

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