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01216cas a22002531 4500 |
001 |
|
100221989 |
003 |
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MiAaHDL |
005 |
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20141013010000.0 |
006 |
|
m d |
007 |
|
cr bn ---auaua |
008 |
|
900530uuuuuuuuunyuuu 0eng u |
035 |
⊔ |
⊔ |
‡asdr-uiuc2519234
|
035 |
⊔ |
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‡aurb00065982
|
035 |
⊔ |
⊔ |
‡9UC 07092302
|
035 |
⊔ |
⊔ |
‡9ARN-6438
|
040 |
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‡dUtOrBLW
|
111 |
2 |
⊔ |
‡aEastern Electronics Packaging Conference.
|
245 |
1 |
0 |
‡aEastern Electronics Packaging Conference :
‡b[proceedings].
|
260 |
⊔ |
⊔ |
‡aNew York :
‡bInstitute of Electrical and Electronics Engineers.
|
300 |
⊔ |
⊔ |
‡a v. :
‡bill. ;
‡c28 cm.
|
500 |
⊔ |
⊔ |
‡aSponsored 1970- by the Component Hybrid and Packaging Technologies Group (called the Parts, Material and Packaging Group) and the Boston Section of the IEEE.
|
500 |
⊔ |
⊔ |
‡aSome vols. have also distinctive titles.
|
538 |
⊔ |
⊔ |
‡aMode of access: Internet.
|
650 |
⊔ |
0 |
‡aMicroelectronics
‡vCongresses.
|
650 |
⊔ |
0 |
‡aElectronic apparatus and appliances
‡xUnit construction
‡vCongresses.
|
650 |
⊔ |
0 |
‡aElectronic apparatus and appliances
‡xDesign and Construction
‡vCongresses.
|
710 |
2 |
⊔ |
‡aInstitute of Electrical and Electronics Engineers.
‡bBoston Section.
|
710 |
2 |
⊔ |
‡aInstitute of Electrical and Electronics Engineers.
‡bComponent Hybrid and Packaging Technologies Group.
|
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⊔ |
⊔ |
‡a100221989
|
DAT |
0 |
⊔ |
‡a20060827183149.0
‡b20141013010000.0
|
DAT |
1 |
⊔ |
‡a20141112173747.0
‡b2024-02-16T18:38:21Z
|
DAT |
2 |
⊔ |
‡a2024-02-16T18:30:02Z
|
CAT |
⊔ |
⊔ |
‡aSDR-UIUC
‡dUNKNOWN
‡lloader.pl-003-020
|
FMT |
⊔ |
⊔ |
‡aSE
|
HOL |
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⊔ |
‡0sdr-uiuc2519234
‡auiug
‡bSDR
‡cUIUC
‡puiug.30112008129840
‡sUIU
‡z1970
‡12519234
|
974 |
⊔ |
⊔ |
‡bUIU
‡cUIUC
‡d20240216
‡sgoogle
‡uuiug.30112008129840
‡z1970
‡y1970
‡ric
‡qbib
‡tUS serial item date >= 1929
|