Sensing, modeling, and simulation in emerging electronic packaging :
presented at the 1996 ASME International Mechanical Engineering Congress and Exposition, November 17-22, 1996, Atlanta, Georgia /
sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by Chao-pin Yeh, Charles Ume.

Description

Related Names

Yeh, Chao-pin.
Ume, Charles.
American Society of Mechanical Engineers. Electrical and Electronic Packaging Division.
International Mechanical Engineering Congress and Exposition Atlanta, Ga.) (1996 :

Language(s)

English

Published

New York, N.Y. : American Society of Mechanical Engineers, c1996.

Subjects

Multichip modules (Microelectronics) > Multichip modules (Microelectronics) / Congresses.
Electronic packaging > Electronic packaging / Congresses.

Physical Description

v, 125 p. : ill. ; 28 cm.

ISBN

079181548X

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