Heat transfer in electronic systems, 1994 :
presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, November 6-11, 1994 /
sponsored by the Heat Transfer Division, ASME ; edited by R.A. Wirtz.

Description

Related Names

Wirtz, R. A.
American Society of Mechanical Engineers. Heat Transfer Division.
International Mechanical Engineering Congress and Exposition Chicago, Ill.) (1994 :

Language(s)

English

Published

New York, N.Y. : American Society of Mechanical Engineers, c1994.

Subjects

Electronic packaging > Electronic packaging / Congresses.
Heat > Heat / Transmission > Heat / Transmission / Congresses.
Electronic apparatus and appliances > Electronic apparatus and appliances / Cooling > Electronic apparatus and appliances / Cooling / Congresses.

Physical Description

vii, 153 p. : ill. ; 28 cm.

ISBN

0791814106

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