Heat transfer in electronic systems, 1994 : presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, November 6-11, 1994

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245 0 0 ‡aHeat transfer in electronic systems, 1994 : ‡bpresented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, November 6-11, 1994 / ‡csponsored by the Heat Transfer Division, ASME ; edited by R.A. Wirtz.
260 ⊔ ⊔ ‡aNew York, N.Y. : ‡bAmerican Society of Mechanical Engineers, ‡cc1994.
300 ⊔ ⊔ ‡avii, 153 p. : ‡bill. ; ‡c28 cm.
504 ⊔ ⊔ ‡aIncludes bibliographical references and index.
538 ⊔ ⊔ ‡aMode of access: Internet.
650 ⊔ 0 ‡aElectronic packaging ‡vCongresses.
650 ⊔ 0 ‡aHeat ‡xTransmission ‡xCongresses.
650 ⊔ 0 ‡aElectronic apparatus and appliances ‡xCooling ‡xCongresses.
700 1 ⊔ ‡aWirtz, R. A.
710 2 ⊔ ‡aAmerican Society of Mechanical Engineers. ‡bHeat Transfer Division.
711 2 ⊔ ‡aInternational Mechanical Engineering Congress and Exposition ‡d(1994 : ‡cChicago, Ill.)
830 ⊔ 0 ‡aHTD (Series) ; ‡vvol. 292.
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