Parameter extraction for electronic packaging and decoupling methodology for power delivery systems

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035 ‡aGLADN185439614
035 ‡a(CSPE)b23074681
040 ‡aCUZ ‡cCUZ ‡dOCLCQ
090 ‡aTK7868.P7 ‡bW36 2003
035 ‡a(OCoLC)55030528
100 1 ‡aWang, Wei.
245 1 0 ‡aParameter extraction for electronic packaging and decoupling methodology for power delivery systems / ‡cby Wei Wang.
260 ‡c2003.
300 ‡axvi 148 leaves ; ‡c28 cm.
500 ‡aTypescript.
502 ‡aThesis (Ph. D.)--University of California, Santa Cruz 2003.
504 ‡aIncludes bibliographical references (leaves 145-148).
538 ‡aMode of access: Internet.
650 0 ‡aElectronic circuit design.
650 0 ‡aElectronic packaging.
650 0 ‡aElectromagnetic compatibility.
650 0 ‡aPrinted circuits ‡xDesign and construction.
655 7 ‡aAcademic dissertations ‡xUniversity of California, Santa Cruz ‡y2003. ‡2rbgenr
655 7 ‡aAcademic dissertations ‡xUniversity of California, Santa Cruz ‡xElectrical Engineering. ‡2rbgenr
CID ‡a102371040
DAT 0 ‡a19170712000000.0 ‡b20180501000000.0
DAT 1 ‡a20180502092517.0 ‡b2024-05-09T17:59:40Z
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