Evaluation of bonding strength development of particleboard using acousto-ultrasonics

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035	⊔	⊔	‡a(OCoLC)41931030
100	1	⊔	‡aChen, Liheng.
245	1	0	‡aEvaluation of bonding strength development of particleboard using acousto-ultrasonics / ‡cby Li-Heng Chen.
260	⊔	⊔	‡c1998.
300	⊔	⊔	‡ax, 118 leaves : ‡bill. ; ‡c28 cm.
502	⊔	⊔	‡aThesis (Ph.D. in Wood Science and Technology)--University of California, Berkeley, Fall 1998.
504	⊔	⊔	‡aIncludes bibliographical references (leaves 102-118).
538	⊔	⊔	‡aMode of access: Internet.
610	2	0	‡aUniversity of California, Berkeley. ‡bDept. of Wood Science and Technology ‡xDissertations.
690	⊔	0	‡aDissertations, Academic ‡xUCB ‡xWood Science and Technology ‡y1991-2000.
CID	⊔	⊔	‡a100830867
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DAT	1	⊔	‡a20151027090559.0 ‡b2024-03-26T17:47:00Z
CAT	⊔	⊔	‡aSDR-NRLF ‡dIII - MILLENIUM ‡lprepare.pl-004-004
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974	⊔	⊔	‡bUC ‡cNRLF ‡d20240326 ‡sgoogle ‡uuc1.c3409182 ‡y1998 ‡ric ‡qbib ‡tUS bib date1 >= 1929