| LDR | 01327cam a2200361 a 4500 | ||
| 001 | 006865985 | ||
| 003 | MiAaHDL | ||
| 005 | 20221205000000.0 | ||
| 006 | m d | ||
| 007 | cr bn ---auaua | ||
| 008 | 741119s1974 dcua b f001 0 eng | ||
| 010 | ⊔ | ⊔ | ‡a73600343 |
| 029 | 1 | ⊔ | ‡aAU@ ‡b000000416182 |
| 029 | 1 | ⊔ | ‡aNLGGC ‡b11301418X |
| 035 | ⊔ | ⊔ | ‡a(MiU)990068659850106381 |
| 035 | ⊔ | ⊔ | ‡asdr-miu.990068659850106381 |
| 035 | ⊔ | ⊔ | ‡asdr-uiuc253201 |
| 035 | ⊔ | ⊔ | ‡z(MiU)MIU01000000000000006865985-goog |
| 035 | ⊔ | ⊔ | ‡a(OCoLC)1119404 |
| 035 | ⊔ | ⊔ | ‡z(MiU)Aleph006865985 |
| 040 | ⊔ | ⊔ | ‡aDLC ‡cDLC ‡dBTCTA ‡dNSBSP |
| 049 | ⊔ | ⊔ | ‡aNSBA |
| 086 | 0 | ⊔ | ‡aC 13.10:400-2 |
| 100 | 1 | ⊔ | ‡aHarman, George G. |
| 245 | 1 | 0 | ‡aMicroelectronic ultrasonic bonding / ‡cGeorge G. Harman, editor. |
| 246 | 1 | 6 | ‡aSemiconductor measurement technology. |
| 260 | ⊔ | ⊔ | ‡a[Washington, D.C.] : ‡bU.S. National Bureau of Standards; [for sale by the Supt. of Docs., U.S. Govt. Print. Off.] ‡c1974. |
| 300 | ⊔ | ⊔ | ‡avi, 102 p. : ‡billus. ; ‡c26 cm. |
| 490 | 0 | ⊔ | ‡aU.S. Department of Commerce National Bureau of Standards special publication ; ‡v400-2 |
| 500 | ⊔ | ⊔ | ‡a"CODEN: XNBSAV." |
| 504 | ⊔ | ⊔ | ‡aIncludes bibliographical references. |
| 538 | ⊔ | ⊔ | ‡aMode of access: Internet. |
| 650 | ⊔ | 0 | ‡aMicroelectronics. |
| 650 | ⊔ | 0 | ‡aUltrasonic welding. |
| 710 | 1 | ⊔ | ‡aUnited States. ‡bNational Bureau of Standards. ‡tSpecial publication. |
| 899 | ⊔ | ⊔ | ‡a39015077585928 |
| CID | ⊔ | ⊔ | ‡a006865985 |
| DAT | 0 | ⊔ | ‡b20221205000000.0 |
| DAT | 1 | ⊔ | ‡a20221206061329.0 ‡b2024-02-24T18:46:52Z |
| CAT | ⊔ | ⊔ | ‡aSDR-MIU ‡cmiu ‡dALMA ‡lprepare.pl-004-008 |
| FMT | ⊔ | ⊔ | ‡aBK |
| HOL | ⊔ | ⊔ | ‡0sdr-miu.990068659850106381 ‡aMiU ‡bSDR ‡cGWLA ‡f006865985 ‡pmdp.39015077585928 ‡sMIU ‡1990068659850106381 |
| 974 | ⊔ | ⊔ | ‡bMIU ‡cGWLA ‡d20240224 ‡sgoogle ‡umdp.39015077585928 ‡y1974 ‡rpd ‡qbib ‡tUS fed doc |
| 974 | ⊔ | ⊔ | ‡bUIU ‡cUIUC ‡d20250101 ‡sgoogle ‡uuiug.30112104131591 ‡z400-2 ‡y1974 ‡rpd ‡qbib ‡tUS fed doc |