| LDR | 01037nam a2200289 a 4500 | ||
| 001 | 002952993 | ||
| 003 | MiAaHDL | ||
| 005 | 20210817000000.0 | ||
| 006 | m d | ||
| 007 | cr bn ---auaua | ||
| 008 | 950330s1995 nyua b 001 0 eng | ||
| 010 | ⊔ | ⊔ | ‡a94046528 |
| 020 | ⊔ | ⊔ | ‡a0471306258 ‡q(cloth : alk. paper) |
| 035 | ⊔ | ⊔ | ‡a(MiU)990029529930106381 |
| 035 | ⊔ | ⊔ | ‡asdr-miu.990029529930106381 |
| 035 | ⊔ | ⊔ | ‡a(OCoLC)31738522 |
| 035 | ⊔ | ⊔ | ‡z(MiU)Aleph002952993 |
| 040 | ⊔ | ⊔ | ‡aDLC ‡cDLC ‡dEYM |
| 050 | 0 | 0 | ‡aTK7874 ‡b.P428 1995 |
| 082 | 0 | 0 | ‡a621.381/046 ‡220 |
| 245 | 0 | 0 | ‡aPlastic-encapsulated microelectronics : ‡bmaterials, processes, quality, reliability, and applications / ‡cedited by Michael G. Pecht, Luu T. Nguyen, Edward B. Hakim. |
| 260 | ⊔ | ⊔ | ‡aNew York : ‡bWiley, ‡cc1995. |
| 300 | ⊔ | ⊔ | ‡axxxiv, 474 p. : ‡bill. ; ‡c25 cm. |
| 500 | ⊔ | ⊔ | ‡a"A Wiley-Interscience publication." |
| 504 | ⊔ | ⊔ | ‡aIncludes bibliographical references and index. |
| 538 | ⊔ | ⊔ | ‡aMode of access: Internet. |
| 650 | ⊔ | 0 | ‡aPlastics in packaging. |
| 650 | ⊔ | 0 | ‡aMicroencapsulation. |
| 650 | ⊔ | 0 | ‡aMicroelectronic packaging ‡xMaterials. |
| 700 | 1 | ⊔ | ‡aHakim, Edward B. |
| 700 | 1 | ⊔ | ‡aNguyen, Luu T. |
| 700 | 1 | ⊔ | ‡aPecht, Michael. |
| CID | ⊔ | ⊔ | ‡a002952993 |
| DAT | 0 | ⊔ | ‡a19950330000000.0 ‡b20210817000000.0 |
| DAT | 1 | ⊔ | ‡a20210915090706.0 ‡b2023-06-17T17:51:44Z |
| CAT | ⊔ | ⊔ | ‡aSDR-MIU ‡dALMA ‡lprepare.pl-004-008 |
| FMT | ⊔ | ⊔ | ‡aBK |
| HOL | ⊔ | ⊔ | ‡0sdr-miu.990029529930106381 ‡aMiU ‡bSDR ‡cMIU ‡pmdp.39015032280102 ‡sMIU ‡1990029529930106381 |
| 974 | ⊔ | ⊔ | ‡bMIU ‡cMIU ‡d20230617 ‡sgoogle ‡umdp.39015032280102 ‡y1995 ‡ric ‡qbib ‡tUS bib date1 >= 1929 |