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950202s1994 nyua b 001 0 eng |
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‡a93009709
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‡a0471594369
‡q(alk. paper)
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‡a(MiU)990029098790106381
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‡b.Q35 1994
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‡a621.381/046
‡220
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‡aQuality conformance and qualification of microelectronic packages and interconnects /
‡cedited by Michael Pecht ... [et al.].
|
260 |
⊔ |
⊔ |
‡aNew York :
‡bWiley,
‡cc1994.
|
300 |
⊔ |
⊔ |
‡axxxiii, 461 p. :
‡bill. ;
‡c25 cm.
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⊔ |
⊔ |
‡a"A Wiley-Interscience publication."
|
504 |
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‡aIncludes bibliographical references (p. 419-450) and index.
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‡aMode of access: Internet.
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‡aQuality assurance.
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‡aElectronic packaging
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‡aElectronic packaging
‡xQuality control.
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‡aElectronic packaging
‡xDefects.
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‡aPecht, Michael.
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