Quality conformance and qualification of microelectronic packages and interconnects

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035 ‡a(OCoLC)27728002
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050 0 0 ‡aTK7870.15 ‡b.Q35 1994
082 0 0 ‡a621.381/046 ‡220
245 0 0 ‡aQuality conformance and qualification of microelectronic packages and interconnects / ‡cedited by Michael Pecht ... [et al.].
260 ‡aNew York : ‡bWiley, ‡cc1994.
300 ‡axxxiii, 461 p. : ‡bill. ; ‡c25 cm.
500 ‡a"A Wiley-Interscience publication."
504 ‡aIncludes bibliographical references (p. 419-450) and index.
538 ‡aMode of access: Internet.
650 0 ‡aQuality assurance.
650 0 ‡aElectronic packaging ‡xTesting.
650 0 ‡aElectronic packaging ‡xQuality control.
650 0 ‡aElectronic packaging ‡xDefects.
700 1 ‡aPecht, Michael.
CID ‡a002909879
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DAT 1 ‡a20210922060713.0 ‡b2023-08-01T17:40:51Z
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974 ‡bMIU ‡cMIU ‡d20230801 ‡sgoogle ‡umdp.39015032183363 ‡y1994 ‡ric ‡qbib ‡tUS bib date1 >= 1929