Electronic packaging reliability :
presented at the 1993 ASME Winter Annual Meeting, New Orleans, Louisiana, November 28-December 3, 1993 /
sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by Luu T. Nguyen, Michael G. Pecht.
APA Citation
Pecht, M., Nguyen, L. T., American Society of Mechanical Engineers. Electrical and Electronic Packaging Division. (1993). Electronic packaging reliability: presented at the 1993 ASME Winter Annual Meeting, New Orleans, Louisiana, November 28-December 3, 1993. New York, N.Y.: American Society of Mechanical Engineers.
MLA Citation
Pecht, Michael, Luu T Nguyen, and American Society of Mechanical Engineers. Electrical and Electronic Packaging Division. Electronic Packaging Reliability: Presented At the 1993 ASME Winter Annual Meeting, New Orleans, Louisiana, November 28-December 3, 1993. New York, N.Y.: American Society of Mechanical Engineers, 1993.
Warning: These citations may not always be complete (especially for serials).