03006nas a22004691a 4500002487014MiAaHDL20250726000000.0m d cr bn ---auaua911202d19901996nyugr 1 a0eng d1087-9870(MiU)990024870140106381sdr-miu.990024870140106381(MiU)MIU01000000000000002487014-goog(SFX)991042731835254(OCoLC)22245265(RLIN)MIUG91-S3228(WaSeSS)ejrnlssj0055130(MiU)Aleph002487014PUPUMiUUtOrBLWInterSociety Conference on Thermal Phenomena in Electronic Systems.http://id.loc.gov/authorities/names/n90682647http://id.loc.gov/rwo/agents/n90682647Intersociety Conference on Thermal Phenomena in Electronic Systems.Proceedings ... InterSociety Conference on Thermal Phenomena in Electronic SystemsI-THERMNew York, NY :Institute of Electrical and Electronics Engineers, Inc.,c1990-c1996.4 v. :ill. ;28 cmBiennialtexttxtrdacontentunmediatednrdamediavolumencrdacarrier2nd (May 23-25, 1990)-5 (May 29-June 1, 1996).Mode of access: Internet.Conference for 1990- sponsored by: IEEE's Components, Hybrids, and Manufacturing Technology Society, ASME's Heat Transfer Division, with the International Society for Hybrid Microelectronics, and the U.S. National Institute of Standards and Technology.Integrated circuitsThermal propertiesCongresses.Electronic circuitsTemperature compensationCongresses.SemiconductorsThermal propertiesCongresses.National Institute of Standards and Technology (U.S.)http://id.loc.gov/authorities/names/n88112126http://id.loc.gov/rwo/agents/n88112126International Society for Hybrid Microelectronics.http://id.loc.gov/authorities/names/n50037241http://id.loc.gov/rwo/agents/n50037241American Society of Mechanical Engineers.Heat Transfer Division.http://id.loc.gov/authorities/names/n84201269http://id.loc.gov/rwo/agents/n84201269IEEE Components, Hybrids, and Manufacturing Technology Society.http://id.loc.gov/authorities/names/n78075303http://id.loc.gov/rwo/agents/n78075303InterSociety Conference on Thermal Phenomena in Electronic Systems.Intersociety Conference on Thermal Phenomena in Electronic Systems (Online)InterSociety Conference on Thermal Phenomena in the Fabrication and Operation of Electronic Components.InterSociety Conference on Thermal Phenomena in the Fabrication and Operation of Electronic ComponentsIntersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.ITHERM(DLC) 00242375(OCoLC)397895023901501542974290CH2798-700248701420241218045826.020250726000000.020260315165229.02026-03-16T08:39:01Z2013-02-01T17:42:16ZSDR-MIUmiuALMAprepare.pl-004-009SEsdr-miu.990024870140106381MiUSDRMIU002487014mdp.39015015429742MIU90CH2798-7990024870140106381MIUMIU20260316googlemdp.3901501542974290CH2798-71996undbibUS bib date2 >= 1931MIUMIU20260319googlemdp.3901502329526792CH3096-51996undbibUS bib date2 >= 1931MIUMIU20260315googlemdp.3901502653153694CH3340-7 19941994icbibUS serial item date >= 1931MIUMIU20260317googlemdp.3901503524762996CB35940 19961996icbibUS serial item date >= 1931