Wafer scale integration, III : proceedings of the Third IFIP WG 10.5 Workshop on Wafer Scale Integration, Como, Italy, 6-8 June 1989

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111 2 ⊔ ‡aIFIP WG 10.5 Workshop on Wafer Scale Integration ‡n(3rd : ‡d1989 : ‡cComo, Italy)
245 1 0 ‡aWafer scale integration, III : ‡bproceedings of the Third IFIP WG 10.5 Workshop on Wafer Scale Integration, Como, Italy, 6-8 June 1989 / ‡cedited by Mariagiovanna Sami, Fausto Distante.
260 ⊔ ⊔ ‡aAmsterdam ; ‡aNew York : ‡bNorth-Holland ; ‡aNew York, N.Y., U.S.A. : ‡bSole distributors for the U.S.A. and Canada, Elsevier Science Pub. Co., ‡c1990.
300 ⊔ ⊔ ‡aix, 402 p. : ‡bill. ; ‡c24 cm.
504 ⊔ ⊔ ‡aIncludes bibliographical references.
538 ⊔ ⊔ ‡aMode of access: Internet.
650 ⊔ 0 ‡aIntegrated circuits ‡xWafer scale integration ‡xCongresses.
700 1 ⊔ ‡aDistante, Fausto.
700 1 ⊔ ‡aSami, Mariagiovanna.
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