Electroplating for the metallurgist, engineer, and chemist

LDR 00698nam a22002291 4500
001 001045446
003 MiAaHDL
005 20210817000000.0
006 m d
007 cr bn ---auaua
008 890208s1951 nyua 00000 eng
010 ‡a51003238
035 ‡a(MiU)990010454460106381
035 ‡asdr-miu.990010454460106381
035 ‡asdr-wu105305
035 ‡a(OCoLC)832901
035 ‡a(SAZTEC)140702860
035 ‡a(CaOTULAS)176086694
035 ‡z(MiU)Aleph001045446
040 ‡cCarP
050 0 ‡aTS670 ‡b.M56
100 1 ‡aMolher, James B., ‡d1910
245 0 0 ‡aElectroplating for the metallurgist, engineer, and chemist,
260 ‡aNew York, ‡bChemical Pub. Co., ‡c1951.
300 ‡a257 p. ‡billus. ‡c23 cm.
538 ‡aMode of access: Internet.
650 0 ‡aElectroplating
700 1 ‡aSedusky, Henry Joseph, ‡d1912- ‡ejoint author.
CID ‡a001045446
DAT 0 ‡a19890208000000.0 ‡b20210817000000.0
DAT 1 ‡a20210928182847.0 ‡b2023-06-16T17:31:12Z
CAT ‡aSDR-MIU ‡dALMA ‡lprepare.pl-004-008
FMT ‡aBK
HOL ‡0sdr-miu.990010454460106381 ‡aMiU ‡bSDR ‡cMIU ‡pmdp.39015000448939 ‡sMIU ‡1990010454460106381
974 ‡bMIU ‡cMIU ‡d20230616 ‡sgoogle ‡umdp.39015000448939 ‡y1951 ‡rpd ‡qren
974 ‡bWU ‡cWU ‡d20230622 ‡sgoogle ‡uwu.89089717318 ‡y1951 ‡rpd ‡qren