Surface mount technology : the future of electronics assembly

LDR 00926nam a22002651a 4500
001 000886689
003 MiAaHDL
005 20210817000000.0
006 m d
007 cr bn ---auaua
008 880908s1987 enka 00010 eng d
020 ‡a0387174303 ‡q(Springer : New York)
020 ‡a0948507403 ‡q(IFS)
035 ‡a(MiU)990008866890106381
035 ‡asdr-miu.990008866890106381
035 ‡a(OCoLC)15195237
035 ‡a(CaOTULAS)175707707
035 ‡a(RLIN)MIUG88-B9940
035 ‡z(MiU)Aleph000886689
040 ‡aCPaHP ‡cCPaHP ‡dMiU
100 1 ‡aMangin, C.-H. ‡q(Charles-Henri)
245 1 0 ‡aSurface mount technology : ‡bthe future of electronics assembly / ‡cC.-H. Mangin and S. McClelland.
260 ‡aBedford, UK : ‡bIFS (Publications) ; ‡aBerlin ; ‡aNew York : ‡bSpringer-Verlag, ‡cc1987.
300 ‡a219 p. : ‡bill. ; ‡c31 cm.
538 ‡aMode of access: Internet.
650 0 ‡aPrinted circuits.
650 0 ‡aElectronic packaging
700 1 ‡aRathmill, K.
700 1 ‡aMcClelland, S. ‡q(Stephen)
710 2 ‡aIFS (Conferences) Ltd.
CID ‡a000886689
DAT 0 ‡a19940411000000.0 ‡b20210817000000.0
DAT 1 ‡a20210924183831.0 ‡b2024-10-06T17:36:44Z
DAT 2 ‡a2024-10-06T17:30:02Z
CAT ‡aSDR-MIU ‡dALMA ‡lprepare.pl-004-008
FMT ‡aBK
HOL ‡0sdr-miu.990008866890106381 ‡aMiU ‡bSDR ‡cMIU ‡pmdp.39015012675008 ‡sMIU ‡1990008866890106381
974 ‡bMIU ‡cMIU ‡d20241006 ‡sgoogle ‡umdp.39015012675008 ‡y1987 ‡ric ‡qbib ‡tnon-US bib date1 >= 1929