ITHERM /
Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.

Description

Previous Title: I-THERM
Meeting Name: InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.
Related Names: Components, Packaging & Manufacturing Technology Society.
InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.
Language(s): English
Published: Piscataway, NJ : IEEE, c1998-
Subjects: Heat > Heat / Transmission > Heat / Transmission / Congresses.
Electronic apparatus and appliances > Electronic apparatus and appliances / Design and construction > Electronic apparatus and appliances / Design and construction / Congresses.
Electronic apparatus and appliances > Electronic apparatus and appliances / Thermal properties > Electronic apparatus and appliances / Thermal properties / Congresses.
Note: Latest issue consulted: 8th (May 30-June 1, 2002).
Sponsored by the: Components, Packaging, and Manufacturing Technology Society, 1998-
Physical Description: v. : ill. ; 28 cm
Locate a Print Version: Find in a library

Item Link	Original Source
Limited (search only) 7(2000:1)	University of Illinois at Urbana-Champaign
Limited (search only) 7(2000:2)	University of Illinois at Urbana-Champaign
Limited (search only) 8(2002)	University of Illinois at Urbana-Champaign
Limited (search only) 9th 2004 v.1	Pennsylvania State University
Limited (search only) 9(2004:1)	University of Illinois at Urbana-Champaign
Limited (search only) 9th 2004 v.2	Pennsylvania State University
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