Integrated circuit, hybrid, and multichip module package design guidelines :
a focus on reliability /
edited by Michael Pecht.

Description

Main Author

Pecht, Michael.

Language(s)

English

Published

New York, N.Y. : Wiley, c1994.

Subjects

Multichip modules (Microelectronics) > Multichip modules (Microelectronics) / Design and construction.
Hybrid integrated circuits > Hybrid integrated circuits / Design and construction.
Electronic packaging > Electronic packaging / Design.

Note

"A Wiley-Interscience publication."

Physical Description

xxxi, 426 p. : ill. ; 24 cm

ISBN

0471594466

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