Intersociety Conference on Thermal Phenomena in Electronic Systems.

Description

New Title: ITHERM
Previous Title: InterSociety Conference on Thermal Phenomena in the Fabrication and Operation of Electronic Components
Meeting Name: InterSociety Conference on Thermal Phenomena in Electronic Systems.
Related Names: National Institute of Standards and Technology (U.S.)
International Society for Hybrid Microelectronics.
American Society of Mechanical Engineers. Heat Transfer Division.
IEEE Components, Hybrids, and Manufacturing Technology Society.
InterSociety Conference on Thermal Phenomena in Electronic Systems.
Language(s): English
Published: New York, NY : Institute of Electrical and Electronics Engineers, Inc., c1990-c1996.
Subjects: Integrated circuits > Integrated circuits / Thermal properties > Integrated circuits / Thermal properties / Congresses.
Electronic circuits > Electronic circuits / Temperature compensation > Electronic circuits / Temperature compensation / Congresses.
Semiconductors > Semiconductors / Thermal properties > Semiconductors / Thermal properties / Congresses.
Note: Conference for 1990- sponsored by: IEEE's Components, Hybrids, and Manufacturing Technology Society, ASME's Heat Transfer Division, with the International Society for Hybrid Microelectronics, and the U.S. National Institute of Standards and Technology.
Physical Description: 4 v. : ill. ; 28 cm
Locate a Print Version: Find in a library