Tools
Methods for testing wire-bond electrical connections / Harry A. Schafft.
| Main Author: | Schafft, Harry A. |
|---|---|
| Language(s): | English |
| Published: |
Washington, D.C. : U.S. Dept. of Commerce, National Bureau of Standards, 1973. |
| Subjects: |
Integrated circuits
> Testing.
Electric connectors > Testing. Wire bonding (Electronic packaging) |
| Physical Description: |
iii, 17 p. :
ill. ;
26 cm.
|
| Original Format: | Book |
| Locate a Print Version: |
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